Common Knowledge of Pick and Place Machine and SMT Production (2)

16. The commonly used SMT steel plate is made of stainless steel;

17. The thickness of the commonly used SMT steel plate is 0.15mm (or 0.12mm);

18. The types of electrostatic charge generation include friction, separation, induction, electrostatic conduction, etc.; the impact of electrostatic charge on the electronics industry is: ESD failure, electrostatic pollution; the three principles of static electricity elimination are electrostatic neutralization, grounding, and shielding;

19. Inch size length x width 0603=0.06inch*0.03inch, metric size length x width 3216=3.2mm*1.6mm;

20. ERB-05604-J81 No. 8 code "4" means 4 loops, and the resistance value is 56 ohms. The capacitance of the capacitor ECA-0105Y-M31 is C=106PF=1NF=1X10-6F;

21. The full name of ECN in Chinese is: Engineering Change Notice; the full name of SWR in Chinese is: Special Requirements Work Order, which must be countersigned by relevant departments and distributed by the document center to be valid;

22. The specific content of 5S is sorting, rectification, sweeping, cleaning, quality;

23. The purpose of PCB vacuum packaging is to prevent dust and moisture;

24. The quality policy is: comprehensive quality control, implementing the system, and providing the quality required by customers; full participation, timely processing, to achieve the goal of zero defects

25. The three-no quality policy is: do not accept defective products, do not manufacture defective products, and do not export defective products;

26. The seven QC techniques refer to the checklist, stratification method, Plato, cause and effect diagram, scatter diagram, histogram, and control diagram;

27. The ingredients of solder paste include: metal powder, solvent, flux, anti-sagging agent, and active agent; by weight, metal powder accounts for 85-92%, and by volume metal powder accounts for 50%;

28. Solder paste must be taken out of the refrigerator to return to temperature when used. The purpose is to restore the temperature of the refrigerated solder paste to normal temperature for printing. If the temperature is not returned, the defect that is likely to occur after the PCBA enters the Reflow is tin beads;

29. The file supply modes of the machine include: preparation mode, priority exchange mode, exchange mode and quick connection mode;

30. SMT PCB positioning methods include: vacuum positioning, mechanical hole positioning, bilateral clamp positioning and board edge positioning;