2023-08-15
1. Generally speaking, the temperature specified in the SMT workshop is 23±7°C;
2. Materials and tools required for solder paste printing: solder paste, steel plate, scraper, wiping paper, dust-free paper, cleaning agent, mixing knife;
3. The commonly used solder paste composition is Sn96.5%/Ag3%/Cu0.5%;
4. The main components of solder paste are divided into two parts: tin powder and flux;
5. The main function of flux in soldering is to remove oxides, destroy the surface tension of molten tin, and prevent re-oxidation;
6. The volume ratio of tin powder particles and Flux (flux) in solder paste is about 1:1, and the weight ratio is about 9:1;
7. The principle of taking solder paste is first in first out;
8. When the solder paste is unpacked and used, it must go through two important processes of warming up and stirring;
9. The common production methods of steel plates are: etching, laser, electroforming;
10. The full name of SMT is Surface mount (or mounting) technology, which means surface adhesion (or mounting) technology in Chinese;
11. The full name of ESD is Electro-static discharge, which means electrostatic discharge in Chinese;
12. When making an SMT equipment program, the program includes five parts, which are PCB data; Mark data; Feeder data; Nozzle data; Part data;
13. The melting point of lead-free solder Sn/Ag/Cu 96.5/3.0/0.5 is 217C;
14. The control relative temperature and humidity of the parts drying box is < 10%;
15. Commonly used passive components (PassiveDevices) include: resistors, capacitors, inductors (or diodes), etc.; active components (ActiveDevices) include: transistors, ICs, etc.;
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